System Engineering

Quality-assured and, at the same time, cost efficient production can only be achieved and maintained by high standards of manufacturing integrity and security.

This requires automatic measurement and test systems that, in accordance with data preparation specific to the tasks at hand, create the basis for controlled interventions into the manufacturing process.

The System Engineering department designs, develops and builds such systems and subsequently integrates them into a test section or manufacturing process.

The department's activities are mainly based on the following physical methods:

  • Couplant-free (EMUS) or piezo-electrical ultrasonic excitation for defect, thickness and surface testing (replacement of magnetic powder and penetrant testing)
  • Couplant-free ultrasonic and/or electromagnetic measurement to determine material parameters
  • Laser-ultrasonic excitation for thickness measurement with rolling temperature
  • Optical dimension measurement and surface testing
  • Leakage-flux and eddy-current testing for checking defects
  • X-ray technologies, also using high-resolution image converters, as well as flat-panel systems as film replacement with automatic defect type recognition

All the above methods are implemented in connection with fast signal or image processing and automatic evaluation. The necessary software is developed in accordance with the specific problem and system.

New development objectives revolve around high-power ultrasound for process optimization, the application of powerful signal-analysis methods for optimizing testing technologies, as well as the use of high-resolution sensors for measuring magnetic leakage fields.

The available measurement and test systems, as well as powerful data acquisition and data processing systems, combined with current expertise, are also harnessed in conducting operational investigations or feasibility studies.